Electronics

Our Digital Enterprise Platform is based on an open, scalable, secure and future-proof architecture. Our solutions help consumer and industrial electronics companies achieve real business value by helping them get to market faster and reduce costs while improving quality and market position.

Value chain partners providing contracted manufacturing and logistics to electronics OEMs

All semiconductor companies (fabs, fabless, IDMs, foundries, OSATs or subcons, and photonics) can use state-of-the-art software solutions for the semiconductor industry from Siemens to drive innovation and increase productivity. Overcome today's challenges while transforming your business into the digital enterprise of tomorrow with edge-to-edge solutions covering all aspects of the semiconductor device (IC, Chip) lifecycle, from concept to design, through production to operations and optimized service lifecycle management.

Equipment and services to enable the production of semiconductor devices

Simcenter FloEFD is a frontload CFD solution, which can be integrated with your CAD tool and perform CFD simulations. Simcenter FloEFD for Electronics industry simulation includes,

• Fan Sizing & placement - choose correct fan sizing to overcome system pressure drop and ensure the fan operates on the correct part of the fan curve
• Heatsink Design & Selection - select the most suitable heat sink for a specific application to minimize cost, weight and pressure drop whilst meeting temperature
• Power Electronics - Sufficiently cool power electronics to ensure operational performance
• Cold Plates & Liquid Cooling - use liquid as the primary cooling medium due to increased power density or cost-effectiveness
• Vent Sizing & Location - Optimize the rate and uniformity of system-level air flow through placement and size of vents
• Air Flow Optimization - Optimize air flow by identifying obstructions such as connectors and heatsinks
• Joule Heating - Joule heating in traces can cause additional voltage drop, trace de-lamination, and even melting of the dielectric
• Case & Junction Temperature Prediction - Meet specification, whether it’s a power package, LED, microprocessor or ASIC by evaluating detailed and compact thermal package models to predict junction and case temperature during design
• Enclosure Thermal Design - to ensure temperature limits are not exceeded and prevent dust ingress
• Heatpipes - Heatpipes are used to transport heat from the source to a heat rejection area or reduce temperature gradients in a heat spreader
• Lighting - Ensure adequate cooling of light bulbs accounting for conduction, convection and radiation losses